1 sheet no.: d1-a01001en date: march 30, 2007 ?sharp corporation GL4800E0000F GL4800E0000F infrared emitting diode notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. side view emission type 2. plastic mold with resin lens 3. medium directivity angle ( ? : 30 typ.) peak emission wavelength: 950 nm typ. 4. radiant flux e: 0.7 mw min. 5. lead free and rohs directive component agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 7 applications 1. optoelectronic switching 2. office automation equipment 3. audio visual equipment 4. home appliances 5. telecommunication equipment 6. measuring equipment 7. tooling machines 8. computers
sheet no.: d1-a01001en 2 GL4800E0000F outline dimensions 8 8 8 2 2 2 8 8 8 3.0 (r.45) (2.54) 0. 8 1.5 1.0 1.6 1.7 0.5 mi n . 3.5 0.3 max. resin bu rr 0.2 max. resin bu rr 1.6 1.25 0. 8 0.1 max. 0.1 max. 0.7 0. 8 0.3 max. gate bu rr 1.65 1. 8 2 - 0.25 2 - 0.9 17.5 0.5 2 +0.3 -0.1 2 - 0.45 +0.3 -0.1 ( 0. 8 ) 1.0e.pi n 1.5e.pi n notes: 1. units: mm 2. unspecified tolerances: 0.2 3. package: pink transparent epoxy resin 4. ( ): reference dimensions 5. the thin bu rr thickness (0.05 mm max.) and the gate bu rr (0.3 mm max.) shall not b e incl u ded in the o u tline dimensions. 6. protr u ded resin 0.3 mm max. ho w e v er, the thin bu rr adheres to the lead 1. 8 mm max. from the resin. 1 1 2 2 cathode anode no. name pin arran g ement 1 2 2 - c0.5
sheet no.: d1-a01001en 3 GL4800E0000F absolute maximum ratings * 1 pulse width: 100 s, duty ratio: 0.01 * 2 3 s (max.) positioned 1.8 mm from the resin edge. electro-optical characteristics parameter symbol rating unit forward current i f 50 ma peak forward current *1 i fm 1a reverse voltage v r 6v power dissipation p 75 mw operating temperature topr -25 to +85 c storage temperature tstg -40 to +85 c soldering temperature *2 tsol 260 c parameter symbol conditions min. typ. max. unit forward voltage v f i f = 20 ma ? 1.2 1.4 v peak forward voltage v fm i fm = 0.5 a ? 3.0 4.0 v reverse current i r v r = 3 v ? ? 10 a radiant flux e i f = 20 ma 0.7 1.6 3.0 mw peak emission wavelength pi f = 5 ma ? 950 ? nm half intensity wavelength ? i f = 5 ma ? 45 ? nm terminal capacitance c t v r = 0, f = 1 mhz ? 70 ? pf cut-off frequency f c ? ? 300 ? khz fig. 1 forward current vs. ambient temperature 0 255075100 8 5 0 10 20 30 40 50 60 -25 for w ard c u rrent i f (ma) am b ient temperat u re t a (c) fig. 2 peak forward cu rrent vs. duty ratio d u ty ratio 10 -3 10 -4 10 -2 10 -1 10 0 10 100 peak for w ard c u rrent i fm (ma) 10,000 1,000 p u lse w idth 100 s t a = 25c (ta = 25c) (ta = 25c)
sheet no.: d1-a01001en 4 GL4800E0000F fig. 3 radiation diagram fig. 4 spectral distribution 8 0 60 40 20 100 0 ang u lar displacement 0 +90 + 8 0 +70 +50 +60 +40 +30 -30 -40 -50 -60 -70 - 8 0 -90 relati v e radiant intensity (%) -20 -10 +10 +20 t a = 25c w a v elength (mm) relati v e radiant intensity (%) 88 0 900 920 940 960 9 8 0 0 20 40 60 8 0 100 i f = 5 ma t a = 25c 1,000 1,020 1,040 fig. 5 peak emi ssion wavelength vs. ambient temperature fig. 6 forward current vs. forward voltage 0 25 50 75 100 900 925 950 975 i f = 5 ma peak emission w a v elength p (nm) -25 am b ient temperat u re ta (c) 1,000 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 500 200 100 50 20 10 5 2 1 for w ard c u rrent i f (ma) for w ard v oltage v f ( v ) t a = 75c 50c -20c 0c 25c
sheet no.: d1-a01001en 5 GL4800E0000F fig. 7 relative radian t flux vs. ambient temperature fig. 8 radiant flux vs. forward current relati v e radiant fl u x 0.1 0.2 0.5 1 2 5 10 20 i f = const. -25 75 50 25 100 0 am b ient temperat u re t a (c) 10 100 1 0.01 0.02 0.05 0.2 0.5 1 2 5 10 0.1 dc for w ard c u rrent i f (ma) radiant fl u x e (m w ) 1,000 p u lse (p u lse w idth 100 s) t a = 25c fig. 9 relative radi ant intensity vs. distance fig. 10 relative coll ector current vs. distance (detec tor: pt4800) relati v e radiant intensity (%) 0.1 1 10 100 0.1 100 10 1 distance to detector (mm) ta = 25c 1 10 100 0.1 100 10 1 0.1 distance to detector (mm) relati v e collector c u rrent (%) i f = 20 ma ta = 25c
sheet no.: d1-a01001en 6 GL4800E0000F design considerations design guidelines 1. allow for natural degradation of th e led as a result of long continuou s operation. this part will have 50 % deg- radation in output after 5 years of continuous use. 2. this product is not designed to be electroma gnetic- and ionized-particle-radiation resistant. manufacturing guidelines cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. soldering instructions 1. sharp recommends not soldering this part using preheat or solder reflow methods. 2. if hand soldering, use temperatures 260c for 3 seconds. 3. when mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the solder, the pad, and the circuit board. 4. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. storage and handling 1. sharp recommends storing these parts between 5c and 30c, at a relative humidity of less than 60 % . 2. after breaking the package seal, sharp recommends maintaining the environment within 5 to 30c, at a relative humidity of less than 60 % . packing specifications 1. parts are packed in a vinyl bag, at an average quantity of 1,000 pieces per bag. 2. bags are secured in a box as shown in illustration on page 7. 3. product mass: 0.07 g (approximately) 4. sharp guarantees the following: a. missing parts will not make up more than 0.1 % of the total quantity. b. parts will be easily removed from the packing.
sheet no.: d1-a01001en 7 GL4800E0000F presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) infrared emitting diode ??????
sheet no.: d1-a01001en 8 GL4800E0000F package specification inner packin g v inyl b ag prod u ct (1,000 pieces) notes: 1. inner packing material : v inyl b ag (polyethylene) 2. q u antity: 1,000 pieces/ b ag cellophane tape model n o., q u antity, and lot n o. notes: 1. o u ter material : packing case (corr u gated card b oard), c u shioning material (urethane), cellophane tape 2. q u antity: 5,000 pieces/ b ox 3. reg u lar packaged mass: approximately 460 g 4. indication: model n o., qu antity, and lot n o. outer packin g v inyl b ag w ith prod u cts (2 b ags) packing case c u shioning material (2 sheets) c u shioning material (2 sheets)
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a01001en 9 GL4800E0000F
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